
808nm 5mW / 10mW / 20mW VCSEL SMD Series
Explore 808nm 5mW, 10mW and 20mW multimode VCSEL SMDs in 3030 and 2835 packages for QCW operation, PCB integration and compact NIR system design.

Explore 808nm 5mW, 10mW and 20mW multimode VCSEL SMDs in 3030 and 2835 packages for QCW operation, PCB integration and compact NIR system design.

808nm 8W Solid-Beam VCSEL bare die with an 18° D86 divergence for higher-output handheld laser hair removal and high-power NIR module integration.

808nm 3W Solid-Beam VCSEL bare die with a 21° D86 divergence for compact handheld laser hair removal, NIR illumination and OEM module integration.

808nm 3W and 8W Solid-Beam VCSEL laser chip series for handheld laser hair removal, QCW NIR illumination, machine vision and OEM integration projects.

808nm 66W VCSEL COB module with a 2.8 × 1.0 cm homogenized spot for QCW hair removal equipment light-source development and high-power NIR integration.

808nm 8W multi-mode VCSEL bare die with 1958 emitters for QCW NIR sources, hair removal equipment and custom optical module development projects.

808nm 60W VCSEL bare die with 8568 emitters for CW-tested high-power NIR sources, custom packaging, thermal validation and optical-module integration.

808nm VCSEL bare die series from low to high power for QCW, pulsed and CW operation in NIR sensing, machine vision, illumination and optical modules.

894.6nm single-mode VCSEL bare die for Cs atomic clock and Cs vapor-cell optical-source development, with narrow linewidth and low-current CW operation.

894.6nm single-mode VCSEL bare die for compact Cs OPM magnetometers and cesium vapor-cell magnetic sensing, with 1.0mW output and ≤50MHz linewidth.

795nm single-mode VCSEL bare die for compact Rb OPM magnetometers and rubidium vapor-cell magnetic sensing, with 0.7mW output and ≤30MHz linewidth.

795nm single-mode VCSEL bare die for Rb atomic clock and CPT vapor-cell optical-source development, with narrow linewidth and 3.4GHz FM modulation support.

780nm VCSEL SMD Series with 2835 and 2121 package options for PCB integration, compact NIR sensing and technical OEM optical-device development projects.

680nm 50mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and high-output red VCSEL chip integration.

680nm 18mW VCSEL bare die with six emitters, 163 × 185μm die size and QCW output at 30mA for wire bonding and higher-output red-laser module integration.

680nm 12mW VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 20mA for wire bonding and custom red-laser module integration.

680nm 5mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

680nm 5/12/18/50mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

680nm 5mW and 34mW peak-output QCW VCSEL SMD series in 2835, 3030 and 5730 packages for scalp PBM, localized red-light and OEM device integration.

670nm 12mW VCSEL bare die with six emitters, 12mW typical QCW output at 25mA and rectangular die geometry for red-light optical-module integration.

670nm 4mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

670nm 9mW VCSEL bare die with four emitters and 9mW typical QCW output at 18mA for square-die red-light source packaging and optical-module integration.

670nm 4mW, 9mW and 12mW VCSEL bare dies for wire bonding, ceramic-submount assembly, custom laser packaging and OEM red optical-source development.

665nm 9mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.