680nm
680nm 18mW VCSEL Bare Die
680nm 18mW VCSEL bare die with six emitters, 163 × 185μm die size and QCW output at 30mA for wire bonding and higher-output red-laser module integration.
Specifications
- Product Type
- VCSEL Bare Die
- Wavelength
- 680 nm typ.
- Optical Output Power
- 18mW class, 15mW min. / 18mW typ. @ IF = 30mA
- Emitter Configuration
- 6 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle at 25°C
- Die Size
- 163±10μm × 185±10μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 680nm 18mW VCSEL Bare Die for Packaging and Module Integration
The 680nm 18mW VCSEL Bare Die is a six-emitter visible-red VCSEL chip designed for die attach, gold-wire bonding, ceramic-submount assembly and customer-defined laser packaging. It gives integration teams a higher-output option within the 680nm bare-die family while preserving the product boundary: the supplied component is a die, not a finished laser module.
Under the datasheet QCW test condition at 25°C, with 0.5ms pulse width and 1% duty cycle, the device provides 15mW minimum and 18mW typical optical output at 30mA. Its six emitters are arranged in a 163±10μm × 185±10μm rectangular die with a 115±3μm × 80±3μm bond pad, creating a package-layout and bonding path distinct from the four-emitter 12mW option.
Development directions include:
- Six-emitter 680nm VCSEL packaging for laser-component manufacturers
- Rectangular-die placement, wire-bonding and ceramic-submount process development
- Higher-output component selection for compact visible-red optical modules
- Sensor-light, machine-vision and consumer-electronics source evaluation
- Sourcing and qualification work comparing adjacent 680nm bare-die configurations
The integration team remains responsible for mechanical protection, electrical connection, heat flow and optical coupling. Optical values stated here are measured under the datasheet condition; they do not promise finished-module output, power density, beam behavior or system performance.
2. Optical Configuration and Packaging Direction
The six-emitter architecture, rectangular outline and 30mA characterization point define the selection role of the 680nm 18mW VCSEL Bare Die. The following values should be used when evaluating driver, package and optical-design compatibility.
Parameter | Datasheet Value |
|---|---|
Optical Output Power | 15mW min. / 18mW typ. @ IF = 30mA |
Wavelength | 675nm min. / 680nm typ. |
Threshold Current | 6.2mA typ. |
Forward Voltage | 2.7V typ. @ IF = 30mA |
Slope Efficiency | 0.6W/A min. / 0.7W/A typ. |
Power Conversion Efficiency | 18% typ. @ IF = 30mA |
Beam Divergence | 23° typ. at 1/e² and IF = 30mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle at 25°C |
Emitter Configuration | 6 emitters |
Die Size | 163±10μm × 185±10μm |
Die Thickness | 130±10μm |
Bond Pad Size | 115±3μm × 80±3μm |
Back Electrode Size | 163±10μm × 185±10μm |
This product is the six-emitter, higher-output choice within the 12mW/18mW comparison when the assembly can accommodate its non-square geometry and documented 30mA QCW test point. That current is a source characterization condition, not an absolute maximum rating or a universal drive recommendation.
For a four-emitter component with 12mW typical output at 20mA and a square 170±10μm × 170±10μm outline, review the 680nm 12mW VCSEL Bare Die. Driver design, bond-pad access, package tooling and optical performance differ and require independent qualification.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The rectangular die outline and six-emitter layout require a package process matched to the 18mW component rather than copied from a square four-emitter die. Engineering reviews should address:
- Orientation and placement controls for a 163μm × 185μm-class die
- Die-attach material, process window and bond-line consistency
- Wire-bond tool access to the 115±3μm × 80±3μm pad
- Ceramic-submount routing, electrical return and heat-flow design
- Protective TO-can, ceramic or application-specific package development
- ESD handling, inspection criteria and packaged-sample qualification
Its non-square outline and wider bond-pad geometry should be reflected in tooling, submount and package drawings. Assembly parameters and thermal limits must be established through process trials and packaged-device measurements.
Lens and Optical Module Integration
The source reports a doughnut-shaped, symmetrical far-field profile and 23° typical beam divergence at 1/e² under the 30mA test condition. These values can guide initial package-to-lens spacing, collimator selection, diffusion and beam-shaping studies for a six-emitter 680nm source.
The completed assembly should be characterized for optical power, power density, working distance, beam distribution, temperature response and mechanical alignment. The package, driver and optical stack determine whether the higher-output component meets the downstream module requirement.
Downstream Application Development
The datasheet lists sensor light sources, consumer electronic products, machine vision and red lighting as potential directions. The 680nm 18mW VCSEL Bare Die may be evaluated when a component-level project requires more output than the adjacent 12mW configuration and can accommodate its emitter count, geometry and current point.
PBM, beauty and hair-growth projects may evaluate this die only as a component-level visible-red optical-source possibility during package or module development. These application examples do not represent medical efficacy, clinical performance, therapeutic claims, regulatory approval or certification of a customer's finished device. Dose, power density, thermal behavior, eye safety, laser classification, complete-system performance and market-specific regulatory validation remain the finished-device developer's responsibility.
4. Evaluation Kit and Documentation Support
The 680nm 18mW VCSEL Bare Die can be discussed for an Evaluation Kit supporting rectangular-die placement, gold-wire bonding, packaged-source and optical-coupling trials. For a useful technical review, provide the target package, proposed QCW drive, thermal concept, lens arrangement and measurement plan.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- Review of six-emitter layout, 18mW output condition and rectangular package geometry
- International shipping quoted according to destination
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What makes the 680nm 18mW VCSEL Bare Die different from the 12mW product?
The 18mW product uses six emitters in a 163±10μm × 185±10μm rectangular die and is characterized at 30mA. The 12mW product uses four emitters in a 170±10μm × 170±10μm square die and is characterized at 20mA.
Those differences affect footprint, bond-pad access, driver design, thermal behavior and optical output. Selection should be based on the planned package and measured module requirements, not only on the nominal power label.
FAQ 2. Which conditions define the 18mW optical output and 23° beam-divergence value?
The datasheet specifies 15mW minimum and 18mW typical optical output at 30mA under QCW operation at 25°C, using 0.5ms pulse width and 1% duty cycle. It also states 23° typical divergence at 1/e² and 30mA.
These values belong to the documented component test condition. A packaged module must be retested with its actual driver, thermal path, optical stack and mechanical tolerances.
FAQ 3. What package changes should be checked for this six-emitter rectangular 680nm VCSEL die?
Check the substrate layout, die orientation, attach footprint, 115±3μm × 80±3μm bond-pad access, wire-loop clearance and the heat path beneath the 163±10μm × 185±10μm die. Tooling and inspection criteria should be designed for the rectangular outline rather than copied from a square-die process.
The assembled source should then be evaluated for optical output, power density, beam distribution, wavelength, temperature behavior and lens alignment under the intended pulse condition.
