
678nm 5mW 2835 VCSEL SMD
678nm 5mW QCW VCSEL SMD in a 2835 package with 22° divergence for visible-red optical-system evaluation, compact PCB integration and OEM development.

678nm 5mW QCW VCSEL SMD in a 2835 package with 22° divergence for visible-red optical-system evaluation, compact PCB integration and OEM development.

650nm 5mW VCSEL SMD series with five PCT and ceramic package options for SMT integration, hair-growth devices, PCB layouts and OEM red-light design.

680nm 50mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and high-output red VCSEL chip integration.

680nm 18mW VCSEL bare die with six emitters, 163 × 185μm die size and QCW output at 30mA for wire bonding and higher-output red-laser module integration.

680nm 12mW VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 20mA for wire bonding and custom red-laser module integration.

680nm 5mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

680nm 5/12/18/50mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

680nm 5mW and 34mW peak-output QCW VCSEL SMD series in 2835, 3030 and 5730 packages for scalp PBM, localized red-light and OEM device integration.

670nm 12mW VCSEL bare die with six emitters, 12mW typical QCW output at 25mA and rectangular die geometry for red-light optical-module integration.

670nm 4mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

670nm 9mW VCSEL bare die with four emitters and 9mW typical QCW output at 18mA for square-die red-light source packaging and optical-module integration.

670nm 4mW, 9mW and 12mW VCSEL bare dies for wire bonding, ceramic-submount assembly, custom laser packaging and OEM red optical-source development.

665nm 9mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

665nm 8mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 15mA for wire bonding and custom red laser packaging.

665nm 7mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 18mA for wire bonding and custom red laser packaging.

665nm 3mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

665nm 3/7/8/9mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

660nm 5mW 3-lead TO-46 VCSEL for low-power laser-source evaluation, TO-can replacement studies and compact optical-module integration for OEM designs.

660nm 7mW class six-emitter VCSEL bare die for high-output red optical-source packaging, wire bonding, ceramic-submount assembly and module development.

660nm 5mW single-emitter VCSEL bare die for compact red-light optical integration, visible indicators, laser-assisted focus and custom OEM modules.

660nm 5mW three-emitter VCSEL bare die for custom red optical-source packaging, wire bonding, ceramic-submount assembly and compact OEM module development.

660nm 2mW single-emitter VCSEL bare die for compact red optical-source packaging, wire bonding, ceramic-submount assembly and OEM module evaluation.

660nm 2mW, 5mW and 7mW VCSEL bare die series with single- and multi-emitter options for wire bonding, ceramic submounts and custom laser packaging.

660nm 5mW and 7mW VCSEL SMD series in 2016, 2835, 3030 and 5730 packages for beauty masks, hair-growth devices, PCB integration and OEM optical design.