660nm
660nm 5mW VCSEL Bare Die
660nm 5mW three-emitter VCSEL bare die for custom red optical-source packaging, wire bonding, ceramic-submount assembly and compact OEM module development.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 660 nm typ.
- Optical Output Power
- 5mW class, 5mW typ. @ IF = 10mA
- Emitter Configuration
- 3 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 200±10 μm × 200±10 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 660nm 5mW VCSEL Bare Die for Three-Emitter Red Optical-Source Development
The 660nm 5mW VCSEL Bare Die is a three-emitter, multi-mode visible-red chip for custom laser packaging, wire bonding, ceramic-submount assembly and compact OEM optical-source development. The source datasheet lists 4.0mW minimum and 5.0mW typical optical output at 10mA and 25°C QCW.
As an unpackaged semiconductor die, it requires a customer-selected package, electrical drive, thermal path, lens or beam-shaping approach and complete finished-device validation.
2. Source-Specified Optical and Electrical Characteristics
At the stated 10mA, 25°C QCW condition, the source lists 660nm typical center wavelength, 4.0mA typical threshold current, 2.6V typical forward voltage and 19° typical divergence.
The source specifies a 200±10μm x 200±10μm die, 125±5μm die thickness, 88±3μm x 88±3μm bond pads and a 200±10μm x 200±10μm back electrode.
3. Bare-Die Assembly and Packaging Direction
The three-emitter configuration and symmetric donut-shaped source far field should be assessed with the selected die-attach process, bonding layout, optics, working distance, pulse drive and thermal design.
For other bare-die output options, review the complete 660nm VCSEL Bare Die Series.
For a 5mW bare-die option with a single emitter and a defined optical aperture, review the 660nm 5mW Single-Emitter VCSEL Bare Die.
4. Evaluation Kit, Documentation and Custom Development Support
For early-stage bare-die assembly and optical evaluation, a 10 pcs / KIT evaluation quantity can be requested for the stated 10mA QCW test condition.
For die attach, bonding, ceramic-submount, package configuration or optical-source requirements, submit the application conditions and target operating parameters for engineering review.
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What output is specified for this 660nm 5mW VCSEL bare die?
The source lists 4.0mW minimum and 5.0mW typical optical output at 10mA and 25°C QCW. Integration conditions determine finished-module output.
FAQ 2. How many emitters are specified for this die?
The product specification identifies three emitters. The final optical result still depends on packaging, optics, alignment, drive and thermal conditions.
FAQ 3. When should an SMD option be considered instead of a bare die?
A bare die is appropriate when the customer controls packaging and optical integration. A packaged SMD option may be considered when PCB-level assembly is the required form factor.
