660nm
660nm 2mW VCSEL Bare Die
660nm 2mW single-emitter VCSEL bare die for compact red optical-source packaging, wire bonding, ceramic-submount assembly and OEM module evaluation.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 660 nm typ.
- Optical Output Power
- 2mW class, 1.5–2.5mW @ IF = 10mA, 25°C
- Emitter Configuration
- Single Emitter
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 200 μm × 200 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 660nm 2mW VCSEL Bare Die for Single-Emitter Red Optical-Source Development
The 660nm 2mW VCSEL Bare Die is a single-emitter, multi-mode visible-red chip for die-level packaging, wire bonding, ceramic-submount assembly and compact red optical-source development. The source datasheet lists 1.5mW minimum and 2.5mW maximum optical output at 10mA and 25°C QCW.
As an unpackaged semiconductor die, it requires a customer-selected mounting, electrical drive, thermal path, optical design and package before use in a finished module or device.
2. Source-Specified Optical and Electrical Characteristics
At the stated 10mA, 25°C QCW condition, the source lists a 660nm typical center wavelength with a 658nm minimum wavelength, 3.0mA typical threshold current, 2.5V typical forward voltage and 20° typical divergence.
The source also specifies a 200μm x 200μm die, 130μm die thickness and 90μm x 90μm bond-pad size. These values are source characteristics, not finished-module guarantees.
3. Bare-Die Assembly and Optical Integration
The source describes a symmetric donut-shaped far-field profile. Evaluate it with the intended lens, collimation or beam-shaping design, working distance, alignment tolerance, pulse drive and thermal path.
For an overview of compatible source options by output level, review the complete 660nm VCSEL Bare Die Series.
4. Evaluation Kit, Documentation and Custom Development Support
For early-stage bare-die assembly and optical evaluation, a 10 pcs / KIT evaluation quantity can be requested for the specified drive and QCW operating condition.
For die attach, wire bonding, ceramic-submount, package or optical-integration requirements, submit the application conditions and target operating parameters for engineering review.
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What output is specified for this 660nm 2mW VCSEL bare die?
The source lists 1.5mW minimum to 2.5mW maximum optical output at 10mA and 25°C QCW. Finished-module output depends on integration and must be measured in the intended system.
FAQ 2. Is this a single-emitter VCSEL die?
Yes. The product specification identifies one emitter in a 200μm x 200μm die.
FAQ 3. Can this bare die be used without a package?
No. It is an unpackaged component and requires suitable assembly, electrical connection, thermal management, optical integration and finished-device validation.
