680nm
680nm 12mW VCSEL Bare Die
680nm 12mW VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 20mA for wire bonding and custom red-laser module integration.
Specifications
- Product Type
- VCSEL Bare Die
- Wavelength
- 680 nm typ.
- Optical Output Power
- 12mW class, 9.0mW min. / 12mW typ. @ IF = 20mA
- Emitter Configuration
- 4 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle at 25°C
- Die Size
- 170±10μm × 170±10μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 680nm 12mW VCSEL Bare Die for Packaging and Module Integration
The 680nm 12mW VCSEL Bare Die is a four-emitter visible-red VCSEL chip for die attach, gold-wire bonding, ceramic-submount assembly and custom laser packaging. It is intended for component and module teams that need a 12mW-class 680nm source in bare-die form rather than a finished laser package.
At 25°C under the datasheet QCW condition of 0.5ms pulse width and 1% duty cycle, the device provides 9.0mW minimum and 12mW typical optical output at 20mA. Its 170±10μm × 170±10μm square die contains four emitters and has an 87±3μm × 85±3μm bond pad, giving packaging engineers defined geometry for die placement, bond-loop planning and submount-layout evaluation.
This configuration is relevant to:
- OSAT teams qualifying a four-emitter 680nm VCSEL die-attach and wire-bonding process
- Laser-component manufacturers developing ceramic, TO-can or custom red-laser packages
- Submount designers working with a 170μm-class square VCSEL die
- Optical-module engineers evaluating a balanced 12mW visible-red component source
- Sourcing teams comparing the 12mW and 18mW options within the 680nm bare-die family
This product is an unpackaged semiconductor die. The customer must design and validate the mounting process, electrical interconnection, thermal path, protective package and downstream optics. Datasheet values describe the component under stated test conditions and do not guarantee the performance of a finished package or optical module.
2. Optical Configuration and Packaging Direction
The four-emitter layout, square outline and 20mA datasheet test point distinguish the 680nm 12mW VCSEL Bare Die. Use the following source values when screening the die for package, driver and optical-system compatibility.
Parameter | Datasheet Value |
|---|---|
Optical Output Power | 9.0mW min. / 12mW typ. @ IF = 20mA |
Wavelength | 675nm min. / 680nm typ. |
Threshold Current | 4.0mA typ. |
Forward Voltage | 2.7V typ. @ IF = 20mA |
Slope Efficiency | 0.6W/A min. / 0.7W/A typ. |
Power Conversion Efficiency | 20% typ. @ IF = 20mA |
Beam Divergence | 23° typ. at 1/e² and IF = 20mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle at 25°C |
Emitter Configuration | 4 emitters |
Die Size | 170±10μm × 170±10μm |
Die Thickness | 130±10μm |
Bond Pad Size | 87±3μm × 85±3μm |
Back Electrode Size | 170±10μm × 170±10μm |
This model is the square-die, four-emitter choice when a project targets the documented 12mW typical output at 20mA and needs moderate multi-emitter layout complexity. The test current and pulse condition are characterization points from the datasheet, not unrestricted drive recommendations for every customer-designed assembly.
For a six-emitter configuration with 18mW typical optical output at 30mA and a compact rectangular outline, compare the 680nm 18mW VCSEL Bare Die. Its current point, emitter layout, bond-pad geometry and die dimensions differ, so it should be qualified as a separate component rather than treated as a drop-in replacement.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The four-emitter structure and square die geometry provide a defined starting point for a 680nm VCSEL packaging process. Relevant engineering work can include:
- Die orientation, placement and attach-process development
- Gold-wire bonding and bond-loop evaluation
- Ceramic-submount routing and pad-access planning
- TO-can, ceramic or application-specific laser-package development
- Thermal-path, package-material and ESD-control verification
- Incoming inspection and alternative-source qualification
The 87±3μm × 85±3μm bond pad and square back electrode help establish tool access and submount layout. Attach material, bonding parameters, protective packaging and thermal limits remain integration decisions that must be validated through controlled assembly trials.
Lens and Optical Module Integration
The datasheet states a doughnut-shaped, symmetrical far-field profile and 23° typical beam divergence at 1/e² under the 20mA test condition. Optical engineers can use these component-level values as initial inputs for collimator selection, package-to-lens spacing, diffusion and beam-shaping studies.
The completed optical source must be measured after packaging. Final beam distribution, optical power, power density, working distance, uniformity and temperature response depend on die placement, electrical drive, package losses and downstream optics.
Downstream Application Development
The source datasheet identifies sensor light sources, consumer electronic products, machine vision and red lighting as application directions. For those uses, the 680nm 12mW VCSEL Bare Die remains a component that must first be packaged and qualified in the intended electrical, thermal and optical system.
PBM, beauty and hair-growth projects may evaluate this die only as a component-level visible-red optical-source possibility during package or module development. These application examples do not represent medical efficacy, clinical performance, therapeutic claims, regulatory approval or certification of a customer's finished device. The finished-device developer remains responsible for dose, power density, thermal behavior, eye safety, laser classification, complete-system performance and market-specific regulatory validation.
4. Evaluation Kit and Documentation Support
The 680nm 12mW VCSEL Bare Die can be discussed for an Evaluation Kit supporting die-attach trials, gold-wire bonding verification and initial packaged-source measurements. A useful technical request should identify the proposed package, QCW drive condition, optical arrangement and evaluation objective.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- Review of wavelength, output, four-emitter layout and package-integration requirements
- International shipping quoted according to destination
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What output, emitter count and die geometry define the 680nm 12mW VCSEL Bare Die?
The datasheet specifies 9.0mW minimum and 12mW typical optical output at 20mA under a 25°C QCW condition with 0.5ms pulse width and 1% duty cycle. The component uses four emitters in a 170±10μm × 170±10μm square die with 130±10μm thickness.
These are bare-die characteristics under the stated test condition. Output from a packaged optical module also depends on die attach, electrical drive, thermal behavior, package losses and optical coupling.
FAQ 2. When should a packaging project select the 12mW four-emitter die instead of the 680nm 18mW option?
Select the 12mW model when the project needs the documented 20mA test point, four emitters and a 170μm-class square outline. The 18mW sibling is characterized at 30mA, uses six emitters and has a 163±10μm × 185±10μm rectangular die.
Selection should follow package footprint, bond-pad access, driver capability, thermal design, required packaged-source output and measured optical performance. The two dies should not be treated as interchangeable without package- and module-level qualification.
FAQ 3. What should an OSAT evaluate when packaging this 680nm 12mW square VCSEL die?
The process plan should cover die orientation, placement accuracy, attach material, cure or reflow profile, bond-pad access, wire material and loop geometry, ESD handling, submount routing, heat flow and package cleanliness. Tooling should be checked against the documented die and bond-pad dimensions.
After assembly, the team should verify wavelength, packaged optical output, beam distribution, power density, temperature behavior and compatibility with the selected lens system under the intended pulse condition.
