808nm
808nm 60W High-Power VCSEL Bare Die
808nm 60W VCSEL bare die with 8568 emitters for CW-tested high-power NIR sources, custom packaging, thermal validation and optical-module integration.
Specifications
- Product Type
- Multi-mode High-Power VCSEL Bare Die
- Wavelength
- 808 nm typ.
- Optical Output Power
- 60 W class / 62 W typ. @ IF = 18 A
- Emitter Configuration
- 8568 emitters
- Operating Mode
- CW test condition, heatsink temperature 25°C
- Die Size
- 5000 μm × 6000 μm
- Recommended Assembly
- Wire bonding / ceramic submount / custom packaging
1. 808nm 60W VCSEL Bare Die for High-Power Packaging and Module Integration
The 808nm 60W High-Power VCSEL Bare Die is a large-area, multi-mode VCSEL array developed for chip-level packaging, ceramic-submount assembly and high-power near-infrared optical-module integration. The device contains 8568 emitters and provides 62 W typical optical output at IF = 18 A under a CW test condition with the heatsink temperature maintained at 25°C.
Its 5000 μm × 6000 μm die dimensions, high emitter density, operating current and 60 W-class output position this model for projects that require substantially greater optical power, current-delivery capacity and thermal-management capability than compact or medium-power 808nm VCSEL chips.
This high-power VCSEL bare die is intended for:
- OSAT semiconductor assembly and test providers
- High-current VCSEL and laser-diode packaging companies
- Die-attach and gold wire-bonding engineering teams
- Ceramic-submount and chip-on-submount integrators
- High-power NIR optical-module manufacturers
- Thermal-management and heatsink-development teams
- Lens, collimation and beam-shaping companies
- Laser hair removal equipment light-source developers
- Industrial optical-source and machine-vision companies
- Laser-component distributors and second-source development teams
As an unpackaged semiconductor die, this product requires suitable die attach, wire bonding, current delivery, heat dissipation, package protection and optical integration. It is not supplied as a finished COB assembly, packaged laser source or complete optical module.
2. Optical Configuration and Packaging Direction
The 808nm 60W High-Power VCSEL Bare Die uses a high-density 8568-emitter array for high-output near-infrared source development. Its electrical, optical and mechanical parameters must be evaluated under the stated CW test condition, drive current and heatsink temperature.
Parameter | Value |
|---|---|
Optical Output Power | 58 W min. / 62 W typ. @ IF = 18 A |
Center Wavelength | 808 nm typ. |
Operating Condition | CW test condition, heatsink temperature 25°C |
Emitter Configuration | 8568 emitters |
Forward Voltage | 8.1 V typ. |
Threshold Current | 3000 mA typ. |
Power Conversion Efficiency | 43% typ. |
Slope Efficiency | 4.2 W/A typ. |
Beam Divergence | 19° typ. at 1/e² |
Die Size | 5000 μm × 6000 μm |
Die Thickness | 1115 μm |
The device can be evaluated for high-current die attach, gold wire bonding, ceramic-submount assembly, chip-on-submount integration and application-specific high-power laser packages. Package design should account for the operating current, bond-pad structure, die area, attachment material, current-delivery path and complete junction-to-heatsink thermal path.
The stated 62 W typical value is a component-level test result under the specified CW condition and heatsink temperature. Final optical output, operating temperature, reliability and usable system performance depend on the completed package, driver, heatsink, optics and module architecture.
3. Packaging, Optical Module and Application Development
OSAT and Custom High-Power VCSEL Packaging
The 808nm 60W VCSEL Bare Die supports high-current die attach, gold wire bonding, ceramic-submount assembly and custom high-power laser-package development. Applicable packaging directions include:
- Large-area VCSEL die attach and bond-line evaluation
- Gold wire-bonding process development
- High-current ceramic-submount assembly
- Chip-on-submount high-power optical sources
- Application-specific laser packages
- Custom VCSEL array packaging
- COB optical-source development
- High-power NIR optical modules
The 8568-emitter array, 18 A test current and 60 W-class output require a suitable electrical interconnect, current-delivery structure and low-thermal-resistance heat-dissipation path. Die-attach materials, bond configuration, ceramic substrate, package protection and heatsink design must be validated under the intended operating conditions.
Lens and Optical Module Integration
The device can support optical companies and module-development teams working on integrated high-power 808nm sources using:
- Collimation-lens assemblies
- Diffuser-integrated optical sources
- Beam-shaping and homogenization components
- Lens-integrated ceramic packages
- High-output near-infrared illumination modules
- Application-specific high-power optical assemblies
Optical integration should be validated using the actual far-field distribution, beam divergence, emitting-area dimensions, package position, lens spacing, diffuser characteristics and complete module architecture. A typical divergence value alone does not define the final spot size, irradiance distribution or usable optical field.
Downstream Application Development
The 808nm 60W VCSEL Bare Die can support component-level development and engineering evaluation for:
- Laser hair removal equipment light-source development
- Medical beauty equipment optical sources
- High-power near-infrared illumination modules
- Industrial optical-source assemblies
- Machine-vision support illumination
- Thermal and high-current packaging evaluation
- Engineering and research optical sources
- Custom high-power VCSEL modules
These are downstream development directions after the bare die has been integrated into a suitable electrical, thermal, mechanical and optical system. The VCSEL bare die is not a finished medical, beauty or hair removal device and does not establish clinical performance, laser safety classification or regulatory approval.
The finished-device developer must independently validate irradiance, operating temperature, optical uniformity, eye and skin safety, laser classification, electrical safety, complete-system performance and applicable market requirements.
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4. Evaluation Kit and Documentation Support
The 808nm 60W VCSEL Bare Die can be evaluated for large-area die-attach trials, wire-bonding verification, ceramic-submount development, high-current driver testing, thermal-path evaluation and initial high-power optical-module integration.
The Evaluation Kit includes:
- 10 pcs / KIT
- 808nm 60W VCSEL Bare Die from one selected configuration
- Corresponding product datasheet
- Corresponding die-dimension documentation
- International shipping quoted according to destination
The following requirements can be discussed according to the project:
- Center wavelength and wavelength tolerance
- Optical output and power-bin selection
- Emitter configuration and chip layout
- High-current driver and operating requirements
- Die attach, wire bonding and ceramic-submount design
- Thermal path, heatsink and package configuration
- Lens, diffuser and optical-module integration
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What packaging and thermal design are required for the 808nm 60W VCSEL Bare Die?
The 808nm 60W VCSEL Bare Die can be evaluated for large-area die attach, gold wire bonding, ceramic-submount assembly, chip-on-submount integration and custom high-power laser packages. Its 8568-emitter configuration, 5000 μm × 6000 μm die dimensions and 18 A CW test current require an appropriate current-delivery structure, attachment material and low-thermal-resistance junction-to-heatsink path. Package temperature, bond reliability, heatsink performance and long-term operating stability must be validated under the intended system conditions.
FAQ 2. When should I select the 808nm 60W VCSEL Bare Die instead of the 8W product or a completed optical module?
The 60W model is intended for projects that require substantially higher optical output and can support its larger die, 18 A current requirement and more demanding thermal architecture. The 808nm 8W VCSEL Bare Die may be more suitable when lower drive current, smaller die dimensions or reduced thermal load are required. Both products are supplied as unpackaged semiconductor dies. Projects that require a completed packaged source, integrated heatsink or finished optical module should follow a separate packaging or module-development path.
FAQ 3. Can the 808nm 60W VCSEL Bare Die be evaluated for laser hair removal equipment and high-power NIR module development?
Yes. The product can support component-level development for laser hair removal equipment light sources, medical beauty equipment optical sources and custom high-power NIR modules. Engineering evaluation should cover the 808nm wavelength, CW test condition, optical output, beam distribution, package temperature, current delivery, bonding reliability and complete optical architecture. The bare die is not a finished hair removal or medical device; the finished-device developer remains responsible for system performance, safety classification and regulatory compliance. Custom wavelength tolerance, optical output, emitter layout, package integration and thermal requirements can be discussed for qualified projects.
