Product Overview
1. High-Power VCSEL Chip for Medical Beauty and NIR Optical Module Evaluation
This 808nm 60W high-power VCSEL chip is designed for high-output near-infrared optical system development, especially for engineering teams working on laser hair removal equipment, medical beauty systems, high-power NIR illumination modules, machine vision light sources, and package-level thermal validation.
The product is suitable for pulse power applications and supports high-density VCSEL emitter integration. It is intended for development-stage evaluation where optical output, thermal management, bonding process, encapsulation design, drive conditions, and module-level reliability must be reviewed before larger-volume planning.
2. Application Development Direction
With a 60W-class 808nm VCSEL output and high-density emitter array design, this product is suitable for handheld and floor-standing laser hair removal devices, medical beauty equipment, high-output NIR illumination modules, machine vision lighting, industrial optical evaluation, and custom high-power optical module development.
Compared with lower-power 808nm VCSEL bare die options, this 60W VCSEL chip is positioned for applications requiring stronger optical output, larger emitter count, higher current drive, package-level heat dissipation design, and more advanced module integration.
For medical beauty and hair removal module development, this chip can help engineering teams evaluate 808nm wavelength suitability, pulse drive conditions, optical output stability, beam divergence, thermal response, bonding process, and high-power module architecture.
For non-beauty optical systems, this chip may also be evaluated for high-output NIR illumination, machine vision support, industrial optical testing, and research-stage optical power scaling where strong 808nm near-infrared output is required.
Reference parameters include 58W minimum and 62W typical optical output power at IF = 18A, 8.1V typical forward voltage, 43% typical power conversion efficiency, 4.2 W/A typical slope efficiency, 19° typical divergence angle at 1/e², 8568 emitters, 5000μm × 6000μm die size, and 1115μm die thickness under the stated test condition.
If the standard configuration does not fully match the project requirement, custom wavelength, output power, emitter configuration, chip layout, thermal design support, encapsulation design, and package-level solutions can also be discussed based on the specific application.
3. Evaluation Sample and Documentation Support
Evaluation sample availability and pricing may vary based on die configuration, power class, thermal design requirement, and project scope. Please contact us to confirm sample availability, sample quantity, and international express shipping cost for this 808nm 60W high-power VCSEL chip.
CE-related documentation is available for project evaluation, including EMC documentation and EN 60825 laser safety / LVD test documentation. Material compliance documentation, including RoHS, REACH, and HF documentation, can also be provided upon request.
Please contact us for sample testing, engineering evaluation, or custom project support.