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four-emitter multi-mode VCSEL bare die
665nm

665nm 8mW VCSEL Bare Die

665nm 8mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 15mA for wire bonding and custom red laser packaging.

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four-emitter multi-mode VCSEL bare die
665nm

665nm 7mW VCSEL Bare Die

665nm 7mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 18mA for wire bonding and custom red laser packaging.

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Single-emitter multi-mode VCSEL bare die
665nm

665nm 3mW VCSEL Bare Die

665nm 3mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

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Multi-emitter VCSEL bare die array for component-level source and custom packaging development
660nm

660nm 7mW VCSEL Bare Die

660nm 7mW class six-emitter VCSEL bare die for high-output red optical-source packaging, wire bonding, ceramic-submount assembly and module development.

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Three-emitter multi-mode VCSEL bare die
660nm

660nm 5mW VCSEL Bare Die

660nm 5mW three-emitter VCSEL bare die for custom red optical-source packaging, wire bonding, ceramic-submount assembly and compact OEM module development.

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Single-emitter multi-mode VCSEL bare die
660nm

660nm 2mW VCSEL Bare Die

660nm 2mW single-emitter VCSEL bare die for compact red optical-source packaging, wire bonding, ceramic-submount assembly and OEM module evaluation.

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