Product Overview
1. Standard Bare Die VCSEL for Medium-Power 850nm NIR Sensing and Illumination
This 850nm 300mW VCSEL bare die is designed for medium-power near-infrared sensing, machine vision auxiliary illumination, industrial optical detection, compact NIR light source modules, and custom VCSEL integration projects.
The product is supplied as a standard bare die device by default. It is suitable for machine vision light source development, industrial sensing modules, active NIR illumination, optical detection systems, and chip-level VCSEL module integration.
With 300mW-class optical output power and 320mW typical output at IF = 350mA, this device provides a useful 850nm VCSEL source for applications requiring stronger NIR output than low-power sensing chips while maintaining compact bare die assembly flexibility.
2. Key Features
This 850nm 300mW VCSEL bare die is supplied as a standard multi-emitter VCSEL chip for medium-power NIR sensing and illumination applications.
Key features include 850nm typical wavelength, 300mW-class optical output power, 320mW typical output at IF = 350mA, 48-emitter bare die structure, 10±1μm emitting aperture, 44% typical power conversion efficiency, 20° typical beam divergence at 1/e², stable central wavelength, and doughnut-shaped symmetrical far-field output.
The bare die format allows flexible integration into ceramic submounts, chip-on-board assemblies, compact optical modules, NIR source modules, and customer-specific VCSEL packages.
Package-level assembly, wire bonding, ceramic submount mounting, thermal path review, beam shaping, divergence control, and customer-specific optical spot requirements can also be reviewed according to the customer's optical and mechanical layout.
3. Application Development Direction
This device supports 850nm NIR sensing, machine vision auxiliary illumination, consumer electronics optical sensing, industrial detection, active optical illumination, compact VCSEL module development, and custom NIR optical source integration.
In a sensing or illumination module design, the VCSEL wavelength, output power, drive current, beam profile, detector response, optical path, package structure, thermal condition, duty cycle, and final system signal behavior should be reviewed together.
The 300mW-class output power provides a useful medium-power source option for compact optical path design, especially where stronger NIR output, multi-emitter die structure, beam shaping, or customized VCSEL package development is required.
4. Evaluation Sample Kit and Documentation Support
Evaluation Sample Kit: USD 29 / KIT, 10 PCs / KIT. International express shipping is typically USD 69–89 depending on destination.
BestLaser Opto Component Device Limited has filed an Initial Product Report with the U.S. FDA CDRH for the Laser Diode Series, including the VCSEL Laser Diode Chip Series. CE-related documentation is also available for project evaluation, including EMC documentation and EN 60825 laser safety / LVD test documentation. Material compliance documentation, including RoHS, REACH, and HF documentation, can also be provided upon request.
For 850nm medium-power sensing, machine vision, industrial detection, and compact optical source projects, bare die mounting, ceramic submount assembly, chip-on-board integration, wire bonding, beam shaping, thermal design, or customized package discussion is available according to the project requirements.
Please contact us for sample testing, engineering evaluation, or custom project support.
850nm 300mW VCSEL Bare Die Datasheet Download ↓
