
850nm 2W CW & QCW VCSEL Bare Die
850nm 2W CW and QCW VCSEL Bare Die with two separate multi-emitter NIR die options for continuous-wave, pulsed operation and OEM optical modules.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 850nm typ.; 840–860nm
- Optical Output Power
- CW: 1.9W min. / 2.1W typ.; QCW: 2.0W min. / 2.2W typ.
- Emitter Configuration
- Multi-emitter VCSEL arrays; QCW: 410 emitters; CW: not specified in the current datasheet
- Operating Mode
- CW / QCW, depending on model
- Die Size
- 1080 ±10μm × 1050 ±10μm / 995μm × 1020μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 850nm 2W CW & QCW VCSEL Bare Die for Packaging and Module Integration
- 850nm 2W CW VCSEL Bare Die
- 850nm 2W QCW VCSEL Bare Die
- Continuous near-infrared illumination
- Pulsed near-infrared illumination
- Machine-vision source development
- Industrial optical detection
- Active sensing
- NIR camera-support lighting
- Ceramic-submount integration
- Custom high-power VCSEL packages
- Lens and diffuser integration
- Engineering and research optical sources
2. Optical Configuration and CW / QCW Version Selection
Parameter | CW Version | QCW Version |
|---|---|---|
Operating Mode | Continuous Wave | QCW / Pulse |
Optical Output | 1.9W min. / 2.1W typ. | 2.0W min. / 2.2W typ. |
Forward Current | 2.2A | 2.8A |
Test Condition | Continuous operation | 0.5ms pulse width, 1% duty cycle, 25°C |
Threshold Current | 400mA typ. / 500mA max. | 550mA typ. / 700mA max. |
Forward Voltage | 2.3V typ. at 20°C | 2.2V typ. |
Beam Divergence | 22° typ., 1/e² | 21° typ., 1/e² |
Slope Efficiency | 1.15W/A typ. | 1.0W/A typ. |
Differential Resistance | 0.18Ω typ. | 0.2Ω typ. |
Power Conversion Efficiency | 43% typ. | 39% typ. |
Die Size | 1080 ±10μm × 1050 ±10μm | 995μm × 1020μm |
Die Thickness | 110 ±10μm | 150μm |
Emitter Count | Not specified in the current datasheet | 410 |
Primary Design Consideration | Continuous thermal dissipation | Pulse-current delivery and timing |
CW Version: Continuous 2W-Class Optical Output
CW Parameter | Minimum | Typical | Maximum | Condition |
|---|---|---|---|---|
Peak Wavelength | 840nm | 850nm | 860nm | CW |
Optical Output Power | 1.9W | 2.1W | — | IF = 2.2A |
Threshold Current | — | 400mA | 500mA | CW |
Forward Voltage | 2.0V | 2.3V | 2.5V | IF = 2.2A, 20°C |
Differential Resistance | — | 0.18Ω | 0.21Ω | CW |
Slope Efficiency | 1.05W/A | 1.15W/A | — | CW |
Power Conversion Efficiency | 37% | 43% | — | IF = 2.2A |
Beam Divergence, 1/e² | 17° | 22° | 24° | IF = 2.2A |
CW Thermal Design
- High-thermal-conductivity die attachment
- Controlled die-attach thickness
- High-conductivity ceramic or equivalent submount
- Multiple wire bonds for current distribution
- Low electrical and thermal interface resistance
- Effective package-to-heatsink contact
- Junction-temperature control
- Ambient-temperature derating
- Long-duration reliability validation
QCW Version: Pulsed 2W-Class Optical Output
QCW Parameter | Minimum | Typical | Maximum | Condition |
|---|---|---|---|---|
Peak Wavelength | 840nm | 850nm | 860nm | QCW |
Optical Output Power | 2.0W | 2.2W | — | IF = 2.8A |
Threshold Current | — | 550mA | 700mA | QCW |
Forward Voltage | 2.0V | 2.2V | 2.4V | IF = 2.8A |
Differential Resistance | — | 0.2Ω | — | QCW |
Slope Efficiency | 0.9W/A | 1.0W/A | — | QCW |
Power Conversion Efficiency | 37% | 39% | — | IF = 2.8A |
Beam Divergence, 1/e² | 18° | 21° | 24° | IF = 2.8A |
QCW Drive Requirements
- Forward current: 2.8A
- Pulse width: 0.5ms
- Duty cycle: 1%
- Test temperature: 25°C
- Peak-current distribution
- Wire-bond resistance
- Pulse-current overshoot
- Die-attach quality
- Submount conductivity
- Transient thermal behavior
- Repetition rate
- External optical alignment
3. Packaging, Optical Module and Application Development
Mechanical Parameter | CW Version | QCW Version |
|---|---|---|
Die Size | 1080 ±10μm × 1050 ±10μm | 995μm × 1020μm |
Die Thickness | 110 ±10μm | 150μm |
Anode Pad Structure | One elongated pad | Two elongated pads |
Anode Pad Size | 1014 ±5μm × 98 ±5μm | 100μm × 855μm × 2 |
Number of Emitters | Not specified in the current datasheet | 410 |
- High-thermal-conductivity ceramic submounts
- Conductive die attachment
- Multi-wire gold bonding
- Custom ceramic laser packages
- Chip-on-board optical assemblies
- High-power SMD package development
- Lens-integrated NIR sources
- Diffuser-integrated illumination modules
- Collimated optical-source assemblies
- Application-specific VCSEL modules
- Die dimensions
- Die thickness
- Bond-pad position
- Number and diameter of bond wires
- Electrical-current distribution
- Die-attach thermal conductivity
- Submount material
- Package-to-heatsink interface
- External lens or diffuser structure
- Optical working distance
- Required illumination field
Downstream Application Development and Version Selection
Select the CW Version When:
- Continuous NIR output is required
- The optical source remains active for extended periods
- The system has a validated continuous thermal path
- Continuous machine-vision illumination is required
- Pulse synchronization is not used
- The package can dissipate sustained electrical and thermal power
Select the QCW Version When:
- The optical source operates in controlled pulses
- Higher pulsed output is required
- The system uses pulse synchronization
- A low duty cycle is acceptable
- The driver can accurately control peak current and pulse width
- Transient illumination is more important than continuous output
- Machine-vision illumination
- Industrial optical detection
- Active NIR sensing
- NIR camera-support lighting
- Proximity and distance detection
- Security and monitoring illumination
- Continuous optical-source modules
- Pulsed optical-source modules
- Custom packaged VCSEL products
- Engineering and research systems
Related Articles
4. Evaluation Kit and Documentation Support
- 10 pcs / KIT
- One selected CW or QCW version per kit
- Corresponding product datasheet
- Corresponding die-dimension and assembly documentation
- International shipping quoted according to destination
- CW or QCW operating mode
- Optical output requirement
- Drive-current condition
- Pulse width and duty cycle
- Die and bond-pad structure
- Ceramic-submount integration
- Multi-wire bonding
- Thermal-path development
- Custom ceramic or SMD packaging
- Lens and diffuser integration
- Volume-supply requirements



