808nm
808nm 20mW 2835 VCSEL SMD
808nm 20mW 2835 VCSEL SMD with 20mW typical optical output, 21° typical D86 divergence and pulsed/QCW operation for higher-output PCB sensing modules.
Specifications
- Product Type
- VCSEL SMD
- Wavelength
- 808nm typ.; 800–816nm
- Optical Output Power
- 20mW typ.; 25mW max.
- Transverse Mode
- Multi-mode VCSEL
- Operating Mode
- QCW / Pulse
- Beam Divergence
- 21° typ., D86
- SMD Package Options
- 2835
1. 808nm 20mW 2835 VCSEL SMD for Higher-Output PCB Sensing Modules
The 808nm 20mW 2835 VCSEL SMD is a multimode near-infrared surface-mount laser source for higher-output PCB sensing, optical detection, machine-vision support illumination and application-specific optical-module development.
Under the specified 25°C test condition with a forward current of 28mA, 0.5ms pulse width and 10% duty cycle, the device provides 20mW typical optical output and 25mW maximum optical output. Its peak wavelength is specified from 800nm to 816nm, with 808nm as the typical value, and its typical beam divergence is 21° D86.
This product provides the highest component-level optical-output class among the 808nm 5mW, 10mW and 20mW SMD configurations. It is intended for projects that can support the 28mA test-current point and require additional optical-output budget within a compact 2835 package.
This configuration is suited to projects that prioritize:
- 20mW typical 808nm optical output
- A 28mA specified test-current point
- A compact 2835 surface-mount package
- Pulsed/QCW source evaluation
- Driver and duty-cycle validation
- PCB-level thermal and optical integration
If the project needs chip-level assembly instead of a completed 2835 component, use the 808nm VCSEL Bare Die Series for product-form comparison.
2. Optical and Electrical Characteristics
The principal optical and electrical characteristics of the 808nm 20mW 2835 VCSEL SMD are shown below.
Parameter | Minimum | Typical | Maximum | Test Condition |
|---|---|---|---|---|
Peak Wavelength | 800nm | 808nm | 816nm | 25°C |
Optical Output Power | — | 20mW | 25mW | IF = 28mA; 25°C; 0.5ms pulse; 10% duty cycle |
Threshold Current | — | 4.5mA | — | 25°C |
Forward Voltage | — | 2.3V | — | IF = 28mA |
Series Resistance | — | 50Ω | — | 25°C |
Slope Efficiency | — | 1W/A | — | 25°C |
Wavelength Temperature Coefficient | — | 0.047nm/°C | — | — |
Beam Divergence, D86 | — | 21° | — | D86 |
The 20mW typical and 25mW maximum optical-output values apply to the stated 28mA, 25°C, 0.5ms-pulse and 10%-duty-cycle test condition. They should not be presented as unconditional output values or compared with another product without its corresponding test condition.
For product selection and integration planning, this configuration uses a Multimode transverse mode and is intended for Pulsed/QCW operation. The optical-output values above remain tied to the stated test condition.
Because this model uses the highest specified current in the three-product SMD group, completed-assembly evaluation should pay particular attention to:
- Pulse-current accuracy and waveform stability
- Driver rise and fall behavior
- PCB trace resistance and parasitics
- Duty-cycle control
- Local heat accumulation
- Solder-joint quality
- Package temperature
- Downstream optical transmission
The device should therefore be characterized with the intended driver, PCB thermal path, optical structure and operating environment.
3. 2835 Package and SMT Integration
The 20mW configuration is supplied in a nominal 2835 surface-mount package intended for direct PCB placement, automated SMT production and compact optical-stack integration.
Package Parameter | Specification |
|---|---|
Nominal Package Type | 2835 VCSEL SMD |
Nominal Package Length | 3.5mm |
Nominal Package Width | 2.8mm |
Nominal Package Height | 0.68mm |
Internal VCSEL Die Size | 7mil × 7mil |
Pin 1 | Anode / positive |
Pin 2 | Cathode / negative |
Tape-and-Reel Quantity | 4,000 pcs / reel |
For this 2835 package, Pin 1 is anode/positive and Pin 2 is cathode/negative. The assignment must be confirmed against the product drawing before PCB release and must not be replaced by the reverse polarity used by the 3030 product.
PCB and production development should verify:
- The recommended 2835 land pattern
- Package polarity before placement
- 28mA pulse-current routing and return path
- Solder-paste volume and stencil design
- Reflow profile for the selected PCB assembly
- ESD controls during storage and handling
- Optical clearance and optical-axis position
- Local thermal behavior at the intended duty cycle
The 20mW and 10mW products share the same nominal package dimensions, but their specified currents and optical-output classes differ. Driver and thermal validation must therefore follow the selected product rather than the package footprint alone.
4. Application Development
The 808nm 20mW 2835 VCSEL SMD is positioned for projects that require the highest optical-output option in the current three-product 808nm SMD group and can support the corresponding drive and thermal conditions.
Higher-Output Sensing and Reflective Measurement
The 20mW typical output can support component-level evaluation where the optical path, target reflectivity, filtering or downstream optics create a higher optical-output requirement than the 5mW or 10mW configurations can provide.
Possible development directions include:
- Photoelectric sensing
- Object and presence detection
- Position and proximity sensing
- Reflective optical measurement
- Industrial detection modules
- PCB-mounted NIR transmitter assemblies
Higher component output does not by itself establish working distance or measurement performance. Detector responsivity, target reflectivity, ambient light, optical transmission, signal processing and the complete transmitter-receiver design must be evaluated together.
Machine-Vision Support and Optical-System Evaluation
The compact 2835 package can support machine-vision support illumination, optical alignment equipment and OEM modules that require a 20mW typical component output under the specified test condition.
The typical 21° D86 beam divergence describes the unshaped component output. A lens, diffuser, window or collimating structure will change the final illuminated field, power distribution and optical alignment requirements.
These directions describe component-level evaluation only. The finished-equipment developer remains responsible for optical safety, laser classification, regulatory review and complete-system performance validation.
5. Evaluation Kit and Documentation Support
Evaluation samples can be discussed for 28mA pulse-driver testing, 2835 PCB-footprint verification, SMT assembly trials, duty-cycle validation, thermal review, optical alignment and initial higher-output sensing-module integration. An Evaluation Kit with 10 pcs / KIT is available for PCB-layout verification, driver testing, pulse-control evaluation, soldering-process development, optical alignment and initial system integration.
Evaluation can support:
- 28mA forward-current testing
- 0.5ms pulse-width and 10% duty-cycle verification
- Pulsed/QCW waveform evaluation
- 2835 land-pattern and polarity review
- SMT placement and reflow-process validation
- PCB thermal-path evaluation
- ESD-handling process review
- 21° typical D86 beam-divergence evaluation
- Comparison with the 5mW and 10mW SMD configurations
For this higher-output configuration, project review can cover wavelength tolerance, power-bin requirements, pulse-current control, duty cycle, PCB thermal path, external optics, package supply and volume-production planning.
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
6. Frequently Asked Questions
FAQ 1. What are the main specifications of the 808nm 20mW 2835 VCSEL SMD?
The product has an 800nm to 816nm specified peak-wavelength range with 808nm as the typical value. Under the stated 25°C, IF = 28mA, 0.5ms-pulse and 10%-duty-cycle condition, it provides 20mW typical and 25mW maximum optical output.
Additional typical values are a 4.5mA threshold current, 2.3V forward voltage and 21° D86 beam divergence.
FAQ 2. What driver and thermal factors should be checked for the 808nm 20mW 2835 VCSEL SMD?
The product is specified at a 28mA forward-current point under a 0.5ms pulse width and 10% duty cycle. Driver evaluation should verify pulse-current accuracy, waveform stability, duty-cycle control, PCB resistance, parasitics and transient behavior.
The 2835 PCB design should also confirm polarity, soldering process, local thermal path, package temperature, optical-axis position and ESD controls under the intended operating condition.
FAQ 3. When should I select the 20mW 2835 model instead of the 5mW or 10mW option?
Select the 20mW 2835 configuration when the project requires the highest typical optical output in this three-product SMD group and the driver and PCB can support the 28mA specified test-current point.
The 808nm 10mW 2835 VCSEL SMD uses the same nominal 2835 package at a lower 15mA test-current point. The 808nm 5mW 3030 VCSEL SMD uses a 3030 package at a 7mA specified current point. Final selection should consider optical-output requirement, current-driver capability, pulse condition, detector sensitivity, PCB thermal behavior, package footprint and downstream optics.
