808nm
808nm 10mW 2835 VCSEL SMD
808nm 10mW 2835 VCSEL SMD with 10mW typical optical output, 21° typical D86 divergence and pulsed/QCW operation for compact PCB sensing integration.
Specifications
- Product Type
- VCSEL SMD
- Wavelength
- 808nm typ.; 800–816nm
- Optical Output Power
- 10mW typ.; 15mW max.
- Transverse Mode
- Multi-mode VCSEL
- Operating Mode
- Pulse / QCW
- Beam Divergence
- 21° typ., D86
- SMD Package Options
- 2835
1. 808nm 10mW 2835 VCSEL SMD for Balanced PCB Sensing Integration
The 808nm 10mW 2835 VCSEL SMD is a multimode near-infrared surface-mount laser source for compact sensing, optical detection, machine-vision support illumination and PCB-mounted optical-module development.
Under the specified 25°C test condition with a forward current of 15mA, 0.5ms pulse width and 10% duty cycle, the device provides 10mW typical optical output and 15mW maximum optical output. Its peak wavelength is specified from 800nm to 816nm, with 808nm as the typical value, and its typical beam divergence is 21° D86.
Within the three-product 808nm SMD group, this model provides a middle optical-output option. It uses the same nominal 2835 package format as the 20mW product while requiring a lower specified forward current, making it suitable for projects balancing optical output, driver capability, PCB footprint and thermal design.
This configuration is suited to projects that prioritize:
- 10mW typical 808nm optical output
- A 15mA specified test-current point
- A compact 2835 surface-mount package
- Pulsed/QCW source evaluation
- Automated SMT placement and reflow-process development
- Component-level sensing and optical measurement
Customers requiring chip-level die attach, wire bonding or custom packaging can compare the 808nm VCSEL Bare Die Series.
2. Optical and Electrical Characteristics
The principal optical and electrical characteristics of the 808nm 10mW 2835 VCSEL SMD are shown below.
Parameter | Minimum | Typical | Maximum | Test Condition |
|---|---|---|---|---|
Peak Wavelength | 800nm | 808nm | 816nm | 25°C |
Optical Output Power | — | 10mW | 15mW | IF = 15mA; 25°C; 0.5ms pulse; 10% duty cycle |
Threshold Current | — | 4.5mA | — | 25°C |
Forward Voltage | — | 2.3V | — | IF = 15mA |
Series Resistance | — | 50Ω | — | 25°C |
Slope Efficiency | — | 1W/A | — | 25°C |
Wavelength Temperature Coefficient | — | 0.047nm/°C | — | — |
Beam Divergence, D86 | — | 21° | — | D86 |
The 10mW typical and 15mW maximum optical-output values apply to the stated 15mA, 25°C, 0.5ms-pulse and 10%-duty-cycle test condition. They should not be detached from that condition when comparing the product with another VCSEL SMD.
For product selection and integration planning, this configuration uses a Multimode transverse mode and is intended for Pulsed/QCW operation. The optical-output values above remain tied to the stated test condition.
Performance in the completed PCB assembly can also be influenced by:
- Current-pulse accuracy and waveform stability
- Driver rise and fall behavior
- PCB trace resistance and parasitics
- Duty-cycle control
- Solder-joint quality
- Package temperature
- External lens, diffuser or window transmission
The device should therefore be evaluated with the intended driver, PCB, optical structure and operating environment.
3. 2835 Package and SMT Integration
The device uses a nominal 2835 surface-mount package for direct PCB placement and automated assembly.
Package Parameter | Specification |
|---|---|
Nominal Package Type | 2835 VCSEL SMD |
Nominal Package Length | 3.5mm |
Nominal Package Width | 2.8mm |
Nominal Package Height | 0.68mm |
Internal VCSEL Die Size | 7mil × 7mil |
Pin 1 | Anode / positive |
Pin 2 | Cathode / negative |
Tape-and-Reel Quantity | 4,000 pcs / reel |
For this 2835 package, Pin 1 is anode/positive and Pin 2 is cathode/negative. This assignment is the reverse of the 3030 package used by the 5mW product and must be confirmed before PCB release and assembly.
PCB and production development should verify:
- The recommended 2835 land pattern
- Package polarity before placement
- Current-pulse routing and return path
- Solder-paste volume and stencil design
- Reflow profile for the selected PCB assembly
- ESD controls during storage and handling
- Optical clearance and optical-axis position
- Local thermal behavior at the intended duty cycle
Because the 10mW and 20mW products share the same nominal package dimensions, mechanical footprint alone is not enough for model selection. The driver current, optical-output requirement and operating condition must also be checked.
4. Application Development
The 808nm 10mW 2835 VCSEL SMD provides a balanced selection point between the lower-current 5mW 3030 configuration and the higher-output 20mW 2835 configuration.
Compact NIR Sensing and Detection
The 10mW typical output and 2835 package can support component-level development of compact sensing and detection modules that require more optical output than the 5mW configuration without moving to the 28mA test-current point of the 20mW product.
Possible development directions include:
- Photoelectric sensing
- Object and presence detection
- Position and proximity sensing
- Reflective optical measurement
- Optical alignment systems
- Compact PCB-mounted NIR transmitters
Detector responsivity, target reflectivity, working distance, ambient light and external optics must be evaluated in the completed system. The component output does not independently establish detection distance or system performance.
Machine-Vision Support and OEM Optical Modules
The 2835 surface-mount format supports compact PCB layouts for machine-vision support illumination, measurement equipment and application-specific OEM optical modules.
The typical 21° D86 beam divergence describes the component output before a lens, diffuser or window is added. The final illuminated area and power distribution depend on downstream optics, package alignment, working distance and mechanical tolerances.
This application description represents component-level development possibilities. It does not establish the safety classification, regulatory status or performance of the customer's finished equipment.
5. Evaluation Kit and Documentation Support
Evaluation samples can be discussed for 15mA pulse-driver testing, 2835 PCB-footprint verification, SMT assembly trials, duty-cycle validation, optical alignment and initial sensing-module integration. An Evaluation Kit with 10 pcs / KIT is available for PCB-layout verification, driver testing, pulse-control evaluation, soldering-process development, optical alignment and initial system integration.
Evaluation can support:
- 15mA forward-current testing
- 0.5ms pulse-width and 10% duty-cycle verification
- Pulsed/QCW waveform evaluation
- 2835 land-pattern and polarity review
- SMT placement and reflow-process validation
- ESD-handling process review
- 21° typical D86 beam-divergence evaluation
- Lens, window or diffuser selection
- Comparison with the 5mW and 20mW SMD configurations
Project-specific requirements can include wavelength tolerance, optical-output selection, drive conditions, package supply, downstream optics and volume-production planning.
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
6. Frequently Asked Questions
FAQ 1. What are the main specifications of the 808nm 10mW 2835 VCSEL SMD?
The product has an 800nm to 816nm specified peak-wavelength range with 808nm as the typical value. Under the stated 25°C, IF = 15mA, 0.5ms-pulse and 10%-duty-cycle condition, it provides 10mW typical and 15mW maximum optical output.
Its typical threshold current is 4.5mA, typical forward voltage is 2.3V and typical beam divergence is 21° D86.
FAQ 2. What should be checked when integrating the 808nm 10mW 2835 VCSEL SMD onto a PCB?
The nominal package dimensions are 3.5 × 2.8mm with a nominal height of 0.68mm. Pin 1 is anode/positive and Pin 2 is cathode/negative.
PCB development should verify the corresponding land pattern, polarity, current-pulse routing, solder-paste design, reflow profile, optical-axis position, ESD controls and thermal behavior under the intended duty cycle.
FAQ 3. When should I select the 10mW 2835 model instead of the 5mW 3030 or 20mW 2835 model?
Select the 10mW 2835 configuration when the project requires more optical output than the 5mW option while retaining a lower specified test current than the 20mW product.
The 808nm 5mW 3030 VCSEL SMD uses a 3030 package and a 7mA specified current point. The 808nm 20mW 2835 VCSEL SMD uses the same nominal 2835 package as the 10mW model but is specified at 28mA and provides 20mW typical optical output under its corresponding test condition.
Final selection should consider optical-output requirement, package footprint, current-driver capability, pulse condition, detector sensitivity, PCB thermal behavior and downstream optics. The 808nm VCSEL SMD Series provides the complete three-configuration comparison.
